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Old 16 May 2020, 13:30   #25
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Join Date: Jan 2008
Location: United Kingdom
Age: 43
Posts: 677
These wont be newly fabricated parts, they will be the original Motorola die, still on wafers. Rochester electronics will remove them from the wafer and package them in a PGA package and datestamp them accordingly.

A process change for a microprocessor to a smaller geometry would not be acceptable to their customers. My employers uses Rochester and a few other long lifecycle suppliers of Microprocessors. If the CPU was changed to a new process, we would have to re-certify the product, depending on the impact of any changes, that could cost up to £1 million. With the older microprocessor families, a die shrink could really screw up the timing and signal integrity of an existing PCB. Newer processors with controlled impedance outputs, e.g. PowerPC with DDR, PCIe, SATA are easier to accept as they are tighter controlled and they have been re-certified easier at lower cost.

Most customers would be in a similar situation and would not want the re-certification costs, we want to buy more of the same.
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