The gfx cards you're talking about all use BGA chips. If you have BGA on the board, you need to choose the right base material of the PCB, otherwise a temperature cycle may put high loads on the solderspot(s). This is due to the different mechanical expansion of the chip and the PCB: At some point, the difference is big enough to make the solderspot crack.
non-BGA chips hardly have that problem, because the pins are long enough to flex with the heat expansion of the board. Forces are low enough to keep all solderspots in place.